Module 1 : GTD-5® Theory of Operation - Review
- Front End: APC, TPC plus DM/CMU
- CPX, DISK, IROC
- IOU, FTU
- Extension Complex
- PCM Network: BUNW, TSW, PCU plus NCU & SSW/SIC
- Lines: ALU, ELU, SLU, XAIU
- Trunks: DCU, EDCU, DS3
- Remotes: RSU incl. RSNW, RLU incl. RLNW, 914 MXU
- Remotes: GR-303 Compliant RDT
- Remotes: SLC-5®, SLC-96®
- PCM Overview
Frequency sampling
Binary
Frames - DS0, DS1
PCMX, PCMR
TSC
- Time-Space-Time
- A Phone Call
Module 2 : Front-End Hardware
- Microprocessor Architecture
Intel 8086/80386SX
Upper & Lower Echelons
DUBE
Address & Data Busses
Dedicated Memory (DMEM) incl. Page Access
MPCC, ADDR, MPBC, CFCA functions
Alarm Registers
REPO LOAD INFO
- Common Memory
CMU (CCM, COM, CMX, CM4X, CM8X)
EXAM CONT PARA
- APC & Peripherals
IOU0 & 1
FTU
MTU/mte
ACD, ACDC, LCDT, RCDT
ICIC/Terminals, TERM7
- TPC
D4MW-DM32 Versions
- MDC
Groups 0-2
APC, TPC, TCU Interfaces
MDCM, MDDI Card Optioning Issues
- SIC
SIC (8 BPC)
SCX (16 BPC)
- CPX
CST/SS7 - incl. DSC Modems
DSUB - DISK - 300MB & 1GB
IROC - GR-303 Function
LANI - OG, Ethernet Connections
- OG
IOMM - GTD-5 IO Terminal
UNIX - UNIX Terminal
BI - Batch Interface Terminal
AMA - Connectapp AMA
Module 3 : PCM & Peripheral Hardware
- BUNW
Time Switch - TSW, TSWE, and TSC
PCU - ACU, CCU, DCU, EDCU
PIU - ALU, ATU, SPAN
NCU - incl. BITS, master timing signal (MTS), oscillator issues
- SSW
Large SSW
Expanded SSW (SSWE or XSS)
Cable & Frame Differences
SIC connections
TCU connections - Rail A&B/C&D
- RSNW incl. Survivability, FIU0-3 & FIU4-7
- RLNW
- MXU
- FTU
KA & KG varieties, Small (Remote)
Functional Block Diagram
Module 4 : Documentation
- User’s Guides - 4008, OG, AMA, XLMF, etc.
- GTD-5 Engineering Documents - how to use:
FA - Functional Assembly
FB - Functional Block
FE - Functional Explanation
EL - Electronic Locator (wiring planes, cable pinouts)
ECD - Equipment Configuration Document
CRL - Cable Running List
PLRG - Product Line Reference Guide
HDWM - Hardware Matrix Report
- Tracing a Lead
Using the EL
Using the FB
- Cabling
Reading Labels
Using the CRL
Using the EL
- Practice
Module 5 : Binary & Hexadecimal
- Binary to Decimal
- Hexadecimal to Decimal
- Hex Words, Bytes, Nibbles
DIAG PRIN4 vs. PRIN3
Convert Hex to Bin
- Advantages to Each Format
- DIAG FTU PHAS30,31 example
- DIAG MRCC PRIN3.3 EPAR2 example
- Practice
Module 6 : System Malfunction Analysis (SMA)
- SMA Classes - priority through deferred
- SMA lookup in UG
- Recognizing Patterns
- SMA Breakdown
Hex & Binary fields
Part 16 Messages
Craftsperson Action
- 1.019 NON-MASKABLE INTERRUPT
Key Fields
Examples
- 3.059 PCM TRACE
Meaning of Fields
Enabling
Examples
- 3.028 EXECUTIVE RESET
Meaning of Fields
Interpreting the Messages, Associated Messages
Craftsperson Action
Module 7 : Diagnostics
- Diagnostics
PRIN3.3 vs PRIN4.4
- Part 15 - Repair Manual
Level 1 Card Repair - card level repair
Level 2 Card Repair - diagnostic info, options
Level 3 Card Repair - diagnostic breakdown, backplane
Practice
- Using System Malfunction Analysis (SMA)
- DIAG vs ROUT
- RUN and ITER
- Execution Parameter (EPARM)
- PUT vs FORC
Module 8 : Practical
- ACU Fault
- BUNW Fault
- FIU Outage - Encapsulated State
- MP Fault - local copy
- MP Fault - cross copy
- DLNK Fault - remote impact
- CMU Fault
- Exercises - by student request
Module 9 : System Database
- Control Parameters
CONT PARA, BILL PARA
- Engineering Parameters
Processors (i.e. EXAM TCU, TSW vs. TSWE, etc.)
Memory (i.e. EXAM CMU, REG BLOC)
Ringing (i.e. EXAM RGG, EXAM FREQ ASSI)
Testing (i.e. EXAM FTU)
Power (i.e. EXAM IOU, ROUT PS)
Alarms (i.e. EXAM AUX, AUXC, AUXS)
- Tracing with FACTS
BTS always provides equipment to have a very successful Hands-On course. BTS also encourages all attendees to bring their own equipment to the course. This will provide attendees the opportunity to incorporate their own gear into the labs and gain valuable training using their specific equipment.